Microelectronics news

dassaultsystemes-signingPurdue-Dassault Systèmes partnership strives to improve, accelerate and transform semiconductor workforce development

Purdue is working to revolutionize workforce development for the semiconductor and microelectronics industry, with its latest collaboration focused on delivering virtual twin capabilities to augment and accelerate semiconductor training, research and sustainability, as well as the development of new skills.

https://www.purdue.edu/uns/images/2024/semiconductor101Purdue offers free foundational course in semiconductor fabrication

Virtually anything electronic has at least one semiconductor chip inside it and likely many more. From smartphones to automobiles and myriad other products and systems, the tiny devices are the physical building blocks of the digital age.

imec-handshakeEuropean technology leader imec opens innovation hub at Purdue

Purdue University and Belgium-based technological innovation organization imec on Friday (Dec. 8) celebrated the grand opening of a research and development hub at the Convergence Center for Innovation and Collaboration on Purdue’s campus. The presence of imec at Purdue will help facilitate groundbreaking advancements in semiconductor technologies.

semiconductor-closeupPurdue establishes an international footprint in chip technology and workforce innovation

Purdue University forges the future of the microelectronics industry, making new partners around the world and expanding its persistent pursuit of microchip advancement through the innovations, partnerships and programs highlighted in this roundup. If you have any questions or would like to speak to a Purdue expert, contact Brian Huchel, bhuchel@purdue.edu.

cheng-nanolaserPurdue laser innovations unleash precision, potential in laser-material interactions

Industrial manufacturers and academic researchers can use patented, innovative laser techniques developed at Purdue University to produce high-tech materials such as semiconductor oxide thin films and metals with high performance under extreme conditions and conduct ultrafine-scale manipulation of physical properties in nanomaterials.

smith-asipNew institute accelerates future of microelectronic system integration, advanced packaging

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems.

zakharov-zsinstrumentsZS Instruments receives $1M grant to develop advanced lithography tech for precision optical encoders

A Purdue University-connected startup has received federal funding to innovate an industry projected to reach $4.4 billion by 2028. The funding will be used to improve the manufacture of sensors used in semiconductor fabrication and inspection, precision machining equipment, UAV guidance and tracking systems, medical imaging equipment, industrial robots, and measuring instruments.

Microelectronics News archive

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