NEW LIMITS NEW materials for LogIc, Memory and InTerconnectS

Recent News

Purdue University Researchers build faster and more reliable memory cells using two-dimensional material stacks.

December 17, 2018

Data use draining your battery? Tiny device to speed up memory while also saving power. The more objects we make "smart," from watches to entire buildings, the greater the need for these devices to store and retrieve massive amounts of data quickly without consuming too much power.

Purdue University Researchers build faster and more reliable memory cells using two-dimensional material stacks.

Prof. Bob Wallace is named a Highly Cited Researcher for 2018!

November 27, 2018

Prof. Wallace is among an elite group recognized for exceptional research performance demonstrated by production of multiple highly cited papers that rank in the top 1% by citations for field and year in Web of Science.

Prof. Bob Wallace is named a Highly Cited Researcher for 2018!

Prof. Joerg Appenzeller has been chosen as the 2018 Aristotle Award recipient!

September 18, 2018

The Aristotle Award was authorized by the SRC Board of Directors in 1995 to recognize professors who best contribute to the development of the industry’s most valuable resource, its human resource. This award recognizes SRC-supported faculty whose deep commitment to the educational experience of SRC students has had a profound and continuing impact on their professional performance and, consequently, a significant impact for members over a long period of time. The awards have been made to some of the most exemplary university faculty in this country, and this year’s award continues that tradition. Professor Joerg Appenzeller from Purdue University is eminently qualified to receive the 2018 Aristotle Award.

Prof. Joerg Appenzeller has been chosen as the 2018 Aristotle Award recipient!

To shrink electronics further, innovative chemical deposition methods may save the day

June 8, 2018

Researchers experiment with area-selective atomic layer deposition to precisely place layers of conducting and insulating materials within circuits

To shrink electronics further, innovative chemical deposition methods may save the day

New Consortium to Advance Semiconductor IoT Hardware

March 15, 2018

The IoT hardware initiative will help U.S. semiconductor producers remain on the cutting edge.

New Consortium to Advance Semiconductor IoT Hardware

NEW LIMITS center to enhance computer chip parts for upcoming advancements

February 26, 2018

Purdue University is leading a new center to overcome the challenges of critical parts needed for low-power, high-performance computer chips in consumer electronics, vehicles and national security.

NEW LIMITS center to enhance computer chip parts for upcoming advancements

NIST Partners with University Effort for Cutting-Edge Semiconductor Technology

February 16, 2018

The U.S. Commerce Department’s National Institute of Standards and Technology (NIST) has awarded its first funds for a research consortium focused on the development of new materials to enable novel computing and storage technologies. NEW LIMITS, for NEW materials for LogIc, Memory, and InTerconnectS, seeks to create innovative solutions that will allow U.S. semiconductor producers to remain on the cutting edge.

NIST Partners with University Effort for Cutting-Edge Semiconductor Technology

NEWLIMITS: NEW materials for LogIc, Memory and InTerconnectS

January 1, 2018

NEWLIMITS: NEW materials for LogIc, Memory and InTerconnectS

NEWLIMITS: NEW materials for LogIc, Memory and InTerconnectS