Guidance Document - Engineering Example List
- Accelerometer
- ADCs (analog-to-digital converters)
- Alloys: aluminum, magnesium, metal powders, nickel, niobium, titanium
- Altimeters
- Amplifiers
- Antennae, for microwave power source, phased array & space
- Array processors/assemblies
- Blanks, beryllium/beryllium (Be/Be) deposited material
- Bulk acoustic wave devices
- Cables, Optical fiber
- Cameras
- Capacitors, high energy storage
- Cathodes
- Ceramic based materials & fibers
- CVD equipment
- Composite materials and structures
- Compound semiconductor integrated circuits
- Computers (rad hard, high temp, high performance, digital, systolic, neural & optical)
- Conductive polymers
- Converter integrated circuits
- Coprocessors or accelerators, graphics
- Cryocoolers for optical sensors
- Cryptographic enabling systems, equipment, integrated circuits, software or technology
- DACs (Digital-to-analog converters)
- Detection systems for explosives and detonators
- Detectors, optical
- Diamond film substrate technology
- Digital array processors
- Digital signal processors
- Digitizers, waveform
- Diodes, laser
- Dry etching equipment, anisotropic plasma
- E.coli, infectious
- Electro-optical materials & integrated circuits
- Electromagnets, superconductive
- Electron beam equipment
- Epitaxial growth equipment
- Fast Fourier Transform (FFT) processors
- Fiber optic magnetometers
- Field programmable gate arrays (FPGA)
- Field programmable logic arrays (FPLA)
- Filters, tunable band-pass
- Frequency analyzers (signal analyzers)
- Gallium organo-metallic compounds; Gallium nitride (GaN) “substrates”
- Gas turbine engine & blades
- Germanium
- Gimbals, optical control
- Graphite
- Gravimeters
- Gyros
- Infectious bacteria or virus
- Information security equipment, software & technology
- Infrared sensors & cameras
- Ion beam equipment for mask making/semiconductor devices
- Integrated circuit computer-aided-design (CAD) software
- Laminates & composite structures, organic metal or carbon
- Laser acoustic detection equipment
- Laser diodes
- Lasers
- Lightweight turbofan/turbojet engines
- Lithograph templates
- Lithography equipment,
- Lithography software
- Logic processors and assemblies
- Machine tools,
- Magnetic metals
- Metals or carbon coated fibers
- Micromachined Angular Rate Sensors
- Microwave circuits & frequency extenders,
- Microwave wave components
- Military items, specially designed
- Mirrors, optical
- Mixers, frequency extenders
- Monolithic integrated circuits
- Multi-layer masks (with phase shift layer),
- Multichip integrated circuits
- Multimode optical fiber & cables, high tensile strength
- Multispectral imaging sensors
- Nanocrystalline alloy strips
- Navigation systems, equipment & components
- Neodymium lasers
- Neural network integrated circuits & computers
- Niobium alloys
- Non-linear optical materials
- Optical components & equipment
- Oscilloscopes
- Plasma separation process equipment & components
- Polymeric substances
- Propeller blades or propfans composite technology
- Propulsion systems/components,
- Quantum cryptography
- Radar systems, components, & SW
- Radar altimeters
- Radiation hardened items
- Radiographic equipment
- Recording equipment, analog & digital tape recorders
- Recovery of source code – software
- Reinforced composite materials
- Remotely operated vehicles
- Resin impregnated fibers
- Reticles
- Robots
- S-parameter test/measurement equipment
- Satellite parts & components
- Scanning electronic beam guns
- Sensors
- Signal processing devices
- Silicon carbide (SiC) substrate blanks
- Silicon, hetero-epitaxial grown multi-layer substrates
- Silicon carbide wafers
- Slapper detonators (Electric)
- Software for restricted items
- Solenoids, superconductive
- Solid-state imaging devices
- Solid-state power semiconductor switches, diodes, or 'modules
- Sonar
- Source code for restricted items or encryption
- SONET (Synchronous Optical Network) technology
- Space launch vehicles
- SQUIDs (Superconducting quantum interference devices)
- Submersible vehicles/vehicle systems, equipment, or components
- Superconductive materials, devices or circuits
- Technology for restricted items
- Test equipment for semiconductor devices
- UAVs Unmanned aerial vehicles
- Wafer probe, production align and expose equipment
- Waveform digitizers
- Wide-swath bathymetric survey systems
- Zinc selenide(ZnSe), substrate blanks
- Zinc sulphide (ZnS), substrate blanks
- Zirconium fluoride (ZrF4) glass
- Zirconium metal, alloy, compounds
Export Restricted Materials
- Helium
- Lithium
- Beryllium
- Boron
- Carbon
- Fluorine
- Magnesium
- Calcium
- Titanium
- Iron
- Cobalt
- Nickel
- Selenium
- Zirconium
- Niobium
- Cesium
- Hafnium
- Tungsten
- Rhenium
- Iridium
- Bismuth
- Polonium
- Promethium
- Gadolinium
- Thulium
- Ytterbium
- Actinium
- Thorium
- Uranium
- Plutonium
- Americium
- Curium
- Californium
- Einsteinium
Contact Information
Address:
Young Hall, 5th floor
Room 548
155 South Grant Street
West Lafayette, IN 47907
Email: rsec@purdue.edu
Phone: (765) 494-1642
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