November 30, 2023
Purdue establishes an international footprint in chip technology and workforce innovation
WEST LAFAYETTE, Ind. — Purdue University forges the future of the microelectronics industry, making new partners around the world and expanding its persistent pursuit of microchip advancement through the innovations, partnerships and programs highlighted in this roundup. If you have any questions or would like to speak to a Purdue expert, contact Brian Huchel, email@example.com.
- A new eight-week Purdue program received nearly 500 applications from students ready to jump-start their training for careers in the semiconductor industry by developing skills related to chip design and manufacturing.
- Mark Johnson, firstname.lastname@example.org
- The SCALE (Scalable Asymmetric Lifecycle Engagement) microelectronics workforce development program will receive funding from the Department of Defense to research radiation-hardened microelectronics and trusted artificial intelligence and to expand student training, continuing education and dissemination.
- Peter Bermel, email@example.com
- President Mung Chiang kicked off the week with a fireside chat with Intel CEO Pat Gelsinger.
- Representatives from the U.S.-Japan UPWARDS Network (University Partnership for Workforce Advancement and Research and Development in Semiconductors) came together for the partnership’s inaugural meeting on campus.
- International partnerships in Europe and with Taiwan, Korea and India were discussed, including Purdue’s work with Belgium-based industry partner imec. The week concluded with the second fall meeting of Purdue’s Semiconductor Degrees Leadership Board, which was attended by 34 industry representatives from 29 companies.
- Mark Lundstrom, firstname.lastname@example.org
- The first Microelectronics Commons annual meeting was held in Washington, D.C., launching the $33 million Silicon Crossroads Hub.
- Purdue will collaborate on semiconductor research and workforce development with many members of the Indiana-led Silicon Crossroads, one of eight Microelectronics Commons Hubs announced under the first major program funded through the CHIPS and Science Act 2022 and the Midwest’s largest hub.
- Mark Lundstrom, email@example.com
- The new Institute for Advanced System Integration and Packaging will enable faster designing and building of microelectronic systems by highlighting Purdue’s established research in system integration and puts new focus on advanced packaging research at the university.
- VIDEO: Purdue researcher Ganesh Subbarayan explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost-effective.
- Ganesh Subbarayan, firstname.lastname@example.org
- The Center for Secure Microelectronics Ecosystem is ushering in a new level of security to protect the essential chips in everything from your car and cellphone to artificial intelligence and machine learning, tackling issues in design and fabrication as well as supply chain.
- Anand Raghunathan, email@example.com; Joerg Appenzeller, firstname.lastname@example.org
Read the latest about semiconductors and microelectronics at Purdue.
About Purdue University
Purdue University is a public research institution with excellence at scale. Ranked among top 10 public universities and with two colleges in the top 4 in the United States, Purdue discovers and disseminates knowledge with a quality and at a scale second to none. More than 105,000 students study at Purdue across modalities and locations, with 50,000 in person on the West Lafayette campus. Committed to affordability and accessibility, Purdue’s main campus has frozen tuition 12 years in a row. See how Purdue never stops in the persistent pursuit of the next giant leap, including its first comprehensive urban campus in Indianapolis, the new Mitchell E. Daniels, Jr. School of Business and Purdue Computes, at https://www.purdue.edu/president/strategic-initiatives.
Writer/Media contact: Brian Huchel, email@example.com