Purdue hosts IEEE Symposium on Reliability for Electronics and Photonics Packaging

Ganesh Subbarayan, Purdue’s James G. Dwyer Professor of Mechanical Engineering (Purdue University photo/ Vincent Walter)

November 14, 2024 Purdue Today

The 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging was hosted Nov. 8-9 at Purdue University. For the first time in its five-year history, the symposium took place in the Silicon Heartland rather than Silicon Valley, bringing together electrical, reliability, materials, mechanical, and computer engineers and applied scientists.

The event featured speakers from Purdue, the University of Maryland, imec, NASA and the National Renewable Energy Laboratory.

Tiwei Wei (right), Purdue assistant professor of mechanical engineering, and David Coenen, a senior researcher at imec (Purdue University photo/ Vincent Walter)
Vanessa Smet, assistant professor in the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology (Purdue University photo/ Vincent Walter)

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