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Guidance Document - Engineering Example List

  • Accelerometer
  • ADCs (analog-to-digital converters)
  • Alloys: aluminum, magnesium, metal powders, nickel, niobium, titanium
  • Altimeters
  • Amplifiers
  • Antennae, for microwave power source, phased array & space
  • Array processors/assemblies
  • Blanks, beryllium/beryllium (Be/Be) deposited material
  • Bulk acoustic wave devices
  • Cables, Optical fiber
  • Cameras
  • Capacitors, high energy storage
  • Cathodes
  • Ceramic based materials & fibers
  • CVD equipment
  • Composite materials and structures
  • Compound semiconductor integrated circuits
  • Computers (rad hard, high temp, high performance, digital, systolic, neural & optical)
  • Conductive polymers
  • Converter integrated circuits
  • Coprocessors or accelerators, graphics
  • Cryocoolers for optical sensors
  • Cryptographic enabling systems, equipment, integrated circuits, software or technology
  • DACs (Digital-to-analog converters)
  • Detection systems for explosives and detonators
  • Detectors, optical
  • Diamond film substrate technology
  • Digital array processors
  • Digital signal processors
  • Digitizers, waveform
  • Diodes, laser
  • Dry etching equipment, anisotropic plasma
  • E.coli, infectious
  • Electro-optical materials & integrated circuits
  • Electromagnets, superconductive
  • Electron beam equipment
  • Epitaxial growth equipment
  • Fast Fourier Transform (FFT) processors
  • Fiber optic magnetometers
  • Field programmable gate arrays (FPGA)
  • Field programmable logic arrays (FPLA)
  • Filters, tunable band-pass
  • Frequency analyzers (signal analyzers)
  • Gallium organo-metallic compounds; Gallium nitride (GaN) “substrates”
  • Gas turbine engine & blades
  • Germanium
  • Gimbals, optical control
  • Graphite
  • Gravimeters
  • Gyros 
  • Infectious bacteria or virus
  • Information security equipment, software & technology
  • Infrared sensors & cameras
  • Ion beam equipment for mask making/semiconductor devices
  • Integrated circuit computer-aided-design (CAD) software
  • Laminates & composite structures, organic metal or carbon
  • Laser acoustic detection equipment
  • Laser diodes
  • Lasers
  • Lightweight turbofan/turbojet engines
  • Lithograph templates
  • Lithography equipment,
  • Lithography software
  • Logic processors and assemblies
  • Machine tools,
  • Magnetic metals
  • Metals or carbon coated fibers
  • Micromachined Angular Rate Sensors
  • Microwave circuits & frequency extenders,
  • Microwave wave components
  • Military items, specially designed
  • Mirrors, optical
  • Mixers, frequency extenders
  • Monolithic integrated circuits
  • Multi-layer masks (with phase shift layer),
  • Multichip integrated circuits
  • Multimode optical fiber & cables, high tensile strength
  • Multispectral imaging sensors
  • Nanocrystalline alloy strips
  • Navigation systems, equipment & components
  • Neodymium lasers
  • Neural network integrated circuits & computers
  • Niobium alloys
  • Non-linear optical materials
  • Optical components & equipment
  • Oscilloscopes
  • Plasma separation process equipment & components
  • Polymeric substances
  • Propeller blades or propfans composite technology
  • Propulsion systems/components,
  • Quantum cryptography
  • Radar systems, components, & SW
  • Radar altimeters
  • Radiation hardened items
  • Radiographic equipment
  • Recording equipment, analog & digital tape recorders
  • Recovery of source code – software
  • Reinforced composite materials
  • Remotely operated vehicles
  • Resin impregnated fibers
  • Reticles
  • Robots
  • S-parameter test/measurement equipment
  • Satellite parts & components
  • Scanning electronic beam guns
  • Sensors
  • Signal processing devices
  • Silicon carbide (SiC) substrate blanks
  • Silicon, hetero-epitaxial grown multi-layer substrates
  • Silicon carbide wafers
  • Slapper detonators (Electric)
  • Software for restricted items
  • Solenoids, superconductive
  • Solid-state imaging devices
  • Solid-state power semiconductor switches, diodes, or 'modules
  • Sonar
  • Source code for restricted items or encryption
  • SONET (Synchronous Optical Network) technology
  • Space launch vehicles
  • SQUIDs (Superconducting quantum interference devices)
  • Submersible vehicles/vehicle systems, equipment, or components
  • Superconductive materials, devices or circuits
  • Technology for restricted items
  • Test equipment for semiconductor devices
  • UAVs Unmanned aerial vehicles
  • Wafer probe, production align and expose equipment
  • Waveform digitizers
  • Wide-swath bathymetric survey systems
  • Zinc selenide(ZnSe), substrate blanks
  • Zinc sulphide (ZnS), substrate blanks
  • Zirconium fluoride (ZrF4) glass
  • Zirconium metal, alloy, compounds

Export Restricted Materials

Periodic table
  • Helium
  • Lithium
  • Beryllium
  • Boron
  • Carbon
  • Fluorine
  • Magnesium
  • Calcium
  • Titanium
  • Iron
  • Cobalt
  • Nickel
  • Selenium
  • Zirconium
  • Niobium
  • Cesium
  • Hafnium
  • Tungsten
  • Rhenium
  • Iridium
  • Bismuth
  • Polonium
  • Promethium
  • Gadolinium
  • Thulium
  • Ytterbium
  • Actinium
  • Thorium
  • Uranium
  • Plutonium
  • Americium
  • Curium
  • Californium
  • Einsteinium

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