Manufacturing Process Applications: Part II

Provided by: ToolingU

This class will introduce you to common finishing and coating processes, printed circuit board fabrication, and common material handling methods.

Course Objectives:

  • Describe final manufacturing processes and material handling
  • Describe finishing
  • Describe deburring
  • Describe barrel and vibratory finishing
  • Describe abrasive flow machining, thermal energy method, and electrochemical deburring
  • Describe honing, lapping, and shot peening
  • Describe the polymer coatings and common polymer coating methods
  • Describe electroplating and anodizing
  • Describe printed circuit boards
  • Describe through-hole technology and wave soldering
  • Describe surface-mount technology and reflow soldering
  • Define material handling
  • Describe robots, automated guided vehicles, and automated storage and retrieval systems
  • Describe barcodes, radio frequency identification, and machine vision
  • Describe material handling loads and unitizing methods.

Recommended Background

  • Recommended for Manufacturing personnel, including technicians, engineers, and managers

Course ID


Skill Focus

Smart Business



Employee Type

New Applicants, Operations teams, 1st level supervisors, Leadership

Method of Delivery


Estimated Effort

2.5 hrs



If you are in WHIN region, contact your HR for a coupon code