Project Computational Modeling of Semiconuctor Materials Program Mechanical Engineering Undergraduate Research Program Term Summer 2025 Status Closed Research Area Computational modeling, Semiconductor Materials Description This undergraduate research project investigates the mechanical behavior of semiconductor materials at the atomic scale to address the critical challenge of reliability in shrinking electronic devices. Using computational modeling techniques, such as molecular dynamics simulations, the study focuses on simulating crack initiation and propagation in silicon carbide (SiC) and aluminum nitride (AlN)—wider bandgap materials critical for high-temperature and high-power applications—to uncover fundamental failure mechanisms, including stress-strain dynamics, dislocation activity, and bond-breaking processes. By analyzing how variables like temperature, strain rate, and crystallographic orientation influence fracture, the project aims to develop predictive models that link microstructure to mechanical performance. The findings will guide the design of defect-resistant semiconductor materials. This interdisciplinary work bridges materials science and mechanical engineering, offering insights to improve next-generation semiconductor technologies while providing the undergraduate researcher with hands-on experience in computational mechanics, data analysis, and advanced material design. Supervisor Shengfeng Yang Mentor Type of work required Computational modeling of mechanical behaviors of semiconductor materials. Websites Qualifications No minimum GPA or previous research experience required. Credit Hours 0 Weekly Hours 10 (estimated)