Project Engineering Materials for Thermal Transport for Semiconductor Packaging Program Engineering First Time Researcher (FTR) Fellowship Term Spring 2025 Status Closed Research Area Thermal Transport, Semiconductors, Materials, Heterogeneous Integration, Advanced Packaging Description Does your phone or laptop ever get too hot to touch? Within electronic devices, heat generated by the components doing calculations must be dissipated to through the electronics package to the environment to prevent failure and to protect the users. This project focuses on engineering materials with either high thermal conductivity to effectively dissipate the heat or extremely low thermal conductivity to isolate and protect delicate components in the system (or combinations of material properties that enable routing of heat within the system). A combination of experimental property measurements, microstructural analysis, and performance tests will help identify routes to achieve better performance. Students are not required to have prior heat transfer or materials experience to apply for and excel at this research project! Option to receive course credit. Supervisor Amy M Marconnet Mentor Type of work required Students in this project will fabricate new materials, measure their thermal properties, analyze their microstructures, integrate them into electronic packages, and/or test their thermal performance. Note that multiple students may contribute to the project in collaboration with graduate student mentoring. Websites https://engineering.purdue.edu/MTEC Qualifications It is beneficial, but not required, for students to have taken thermodynamics, fluid dynamics, and/or heat transfer courses. Programming and experimental skills are a plus. Credit Hours 0 Weekly Hours 10 (estimated)