{"id":6975,"date":"2023-11-30T11:13:00","date_gmt":"2023-11-30T15:13:00","guid":{"rendered":"https:\/\/new.www.purdue.edu\/newsroom\/?p=6975"},"modified":"2024-07-26T11:16:24","modified_gmt":"2024-07-26T15:16:24","slug":"purdue-establishes-an-international-footprint-in-chip-technology-and-workforce-innovation","status":"publish","type":"post","link":"https:\/\/www.purdue.edu\/newsroom\/2023\/Q4\/purdue-establishes-an-international-footprint-in-chip-technology-and-workforce-innovation","title":{"rendered":"Purdue establishes an international footprint in chip technology and workforce innovation"},"content":{"rendered":"<div class=\"purdue-initial-words-wrap\"><p class=\"purdue-initial-words wp-block-paragraph\">WEST LAFAYETTE, Ind. &mdash;<\/p> \n<p>Purdue University forges the future of the microelectronics industry, making new partners around the world and expanding its persistent pursuit of microchip advancement through the innovations, partnerships and programs highlighted in this roundup. If you have any questions or would like to speak to a Purdue expert, contact Brian Huchel,&nbsp;<a href=\"mailto:bhuchel@purdue.edu\">bhuchel@purdue.edu<\/a>.<\/p>\n<\/div>\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/stories.purdue.edu\/seeing-stars-purdue-trains-next-generation-of-semiconductor-engineers\/?_ga=2.186540393.1160457853.1699880560-1657654290.1670942545\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>Seeing STARS: Purdue trains next generation of semiconductor engineers<\/strong><\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>A new eight-week Purdue program received nearly 500 applications from students ready to jump-start their training for careers in the semiconductor industry by developing skills related to chip design and manufacturing.<\/li>\n\n\n\n<li><a href=\"https:\/\/engineering.purdue.edu\/Mark-Johnson\" target=\"_blank\" rel=\"noreferrer noopener\">Mark Johnson<\/a>,\u00a0<a href=\"mailto:mcjohnso@purdue.edu\">mcjohnso@purdue.edu<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/www.purdue.edu\/newsroom\/releases\/2023\/Q3\/second-funding-round-delivers-19-million-to-purdue-led-microelectronics-workforce-development-program.html\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>Federal funding delivers $19 million to Purdue-led microelectronics workforce development program<\/strong><\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The\u00a0<a href=\"https:\/\/research.purdue.edu\/scale\/\" target=\"_blank\" rel=\"noreferrer noopener\">SCALE (Scalable Asymmetric Lifecycle Engagement)<\/a>\u00a0microelectronics workforce development program will receive funding from the Department of Defense to research radiation-hardened microelectronics and trusted artificial intelligence and to expand student training, continuing education and dissemination.<\/li>\n\n\n\n<li><a href=\"https:\/\/engineering.purdue.edu\/ECE\/People\/Archives\/ptProfile?resource_id=75045\" target=\"_blank\" rel=\"noreferrer noopener\">Peter Bermel<\/a>,\u00a0<a href=\"mailto:pbermel@purdue.edu\">pbermel@purdue.edu<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/engineering.purdue.edu\/Engr\/AboutUs\/News\/Spotlights\/2023\/2023-1102-semiconductor-week-recap?_ga=2.249049351.1238594272.1700583878-1657654290.1670942545\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>Purdue Semiconductor Week 2023 features inaugural meetings, brings top industry officials to campus<\/strong><\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>President Mung Chiang kicked off the week with a fireside chat with Intel CEO Pat Gelsinger.<\/li>\n\n\n\n<li>Representatives from the U.S.-Japan UPWARDS Network (University Partnership for Workforce Advancement and Research and Development in Semiconductors) came together for the partnership\u2019s inaugural meeting on campus.<\/li>\n\n\n\n<li>International partnerships in Europe and with Taiwan, Korea and India were discussed, including Purdue\u2019s work with Belgium-based industry partner imec. The week concluded with the second fall meeting of Purdue\u2019s\u00a0<a href=\"https:\/\/engineering.purdue.edu\/semiconductors\/degrees-leadership-board\" target=\"_blank\" rel=\"noreferrer noopener\">Semiconductor Degrees Leadership Board<\/a>, which was attended by 34 industry representatives from 29 companies.\u00a0<\/li>\n\n\n\n<li><a href=\"https:\/\/engineering.purdue.edu\/ECE\/People\/ptProfile?resource_id=3140\" target=\"_blank\" rel=\"noreferrer noopener\">Mark Lundstrom<\/a>,\u00a0<a href=\"mailto:lundstro@purdue.edu\">lundstro@purdue.edu<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/www.purdue.edu\/newsroom\/releases\/2023\/Q3\/purdues-semiconductor-innovation-ecosystem-grows-with-chips-funded-indiana-led-semiconductor-hub-and-upcoming-summit.html\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>Purdue\u2019s semiconductor innovation grows with CHIPS-funded, Indiana-led semiconductor hub<\/strong><\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The first Microelectronics Commons annual meeting was held in Washington, D.C., launching the $33 million\u00a0<a href=\"https:\/\/www.purdue.edu\/newsroom\/releases\/2023\/Q3\/purdues-semiconductor-innovation-ecosystem-grows-with-chips-funded-indiana-led-semiconductor-hub-and-upcoming-summit.html\" target=\"_blank\" rel=\"noreferrer noopener\">Silicon Crossroads Hub<\/a>.<\/li>\n\n\n\n<li>Purdue\u00a0will collaborate\u00a0on semiconductor research and workforce\u00a0development with many members of the\u00a0Indiana-led Silicon Crossroads, one\u00a0of\u00a0eight Microelectronics Commons Hubs announced under the\u00a0first major program funded through the\u00a0CHIPS and Science\u00a0Act 2022 and the\u00a0Midwest\u2019s largest hub.<\/li>\n\n\n\n<li><a href=\"https:\/\/engineering.purdue.edu\/ECE\/People\/ptProfile?resource_id=3140\" target=\"_blank\" rel=\"noreferrer noopener\">Mark Lundstrom<\/a>,\u00a0<a href=\"mailto:lundstro@purdue.edu\">lundstro@purdue.edu<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/www.purdue.edu\/newsroom\/releases\/2023\/Q4\/new-institute-accelerates-future-of-microelectronic-system-integration-advanced-packaging.html\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>New institute accelerates future of microelectronic system integration, advanced packaging<\/strong><\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The new Institute for Advanced System Integration and Packaging will enable faster designing and building of microelectronic systems by highlighting Purdue\u2019s established research in system integration and puts new focus on advanced packaging research at the university.<\/li>\n\n\n\n<li><a href=\"https:\/\/youtu.be\/ldpRWRpXl_M\" target=\"_blank\" rel=\"noreferrer noopener\">VIDEO<\/a>: Purdue researcher Ganesh Subbarayan explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost-effective.<\/li>\n\n\n\n<li><a href=\"https:\/\/engineering.purdue.edu\/ME\/People\/ptProfile?resource_id=11244\" target=\"_blank\" rel=\"noreferrer noopener\">Ganesh Subbarayan<\/a>,\u00a0<a href=\"mailto:ganeshs@purdue.edu\">ganeshs@purdue.edu<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><a href=\"https:\/\/www.purdue.edu\/newsroom\/releases\/2023\/Q4\/purdue-center-addresses-pressing-challenge-of-securing-semiconductor-chips.html\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>Purdue center addresses pressing challenge of securing semiconductor chips<\/strong><\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The\u00a0<a href=\"https:\/\/engineering.purdue.edu\/CSME\" target=\"_blank\" rel=\"noreferrer noopener\">Center for Secure Microelectronics Ecosystem<\/a>\u00a0is ushering in a new level of security to protect the essential chips in everything from your car and cellphone to artificial intelligence and machine learning, tackling issues in design and fabrication as well as supply chain.<\/li>\n\n\n\n<li><a href=\"https:\/\/engineering.purdue.edu\/ECE\/People\/ptProfile?resource_id=46143\" target=\"_blank\" rel=\"noreferrer noopener\">Anand Raghunathan<\/a>,\u00a0<a href=\"mailto:raghunathan@purdue.edu\">raghunathan@purdue.edu<\/a>;\u00a0<a href=\"https:\/\/engineering.purdue.edu\/ECE\/People\/ptProfile?resource_id=32402&amp;_ga=2.42474533.1238594272.1700583878-1657654290.1670942545\" target=\"_blank\" rel=\"noreferrer noopener\">Joerg Appenzeller<\/a>,\u00a0<a href=\"mailto:appenzeller@purdue.edu\">appenzeller@purdue.edu<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Read the latest about&nbsp;<a href=\"https:\/\/engineering.purdue.edu\/semiconductors\" rel=\"noreferrer noopener\" target=\"_blank\"><strong>semiconductors and microelectronics at Purdue<\/strong><\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">About Purdue University<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Purdue University is a public research institution with excellence at scale. Ranked among top 10 public universities and with two colleges in the top 4 in the United States, Purdue discovers and disseminates knowledge with a quality and at a scale second to none. More than 105,000 students study at Purdue across modalities and locations, with 50,000 in person on the West Lafayette campus. Committed to affordability and accessibility, Purdue\u2019s main campus has frozen tuition 12 years in a row. See how Purdue never stops in the persistent pursuit of the next giant leap, including its first comprehensive urban campus in Indianapolis, the new Mitchell E. Daniels, Jr. School of Business and Purdue Computes, at&nbsp;<a href=\"https:\/\/www.purdue.edu\/president\/strategic-initiatives\" rel=\"noreferrer noopener\" target=\"_blank\">https:\/\/www.purdue.edu\/president\/strategic-initiatives<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>WEST LAFAYETTE, Ind. &mdash; Purdue University forges the future of the microelectronics industry, making new partners around the world and expanding its persistent pursuit of microchip advancement through the innovations, partnerships and programs highlighted in this roundup. If you have<\/p>\n","protected":false},"author":7,"featured_media":6976,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"department":[31],"source":[29],"purdue_today_topic":[],"coauthors":[40],"class_list":["post-6975","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized","department-engineering","source-purdue-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/posts\/6975","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/comments?post=6975"}],"version-history":[{"count":1,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/posts\/6975\/revisions"}],"predecessor-version":[{"id":6977,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/posts\/6975\/revisions\/6977"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/media\/6976"}],"wp:attachment":[{"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/media?parent=6975"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/categories?post=6975"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/tags?post=6975"},{"taxonomy":"department","embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/department?post=6975"},{"taxonomy":"source","embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/source?post=6975"},{"taxonomy":"purdue_today_topic","embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/purdue_today_topic?post=6975"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.purdue.edu\/newsroom\/wp-json\/wp\/v2\/coauthors?post=6975"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}