{"id":19235,"date":"2026-01-16T09:30:15","date_gmt":"2026-01-16T14:30:15","guid":{"rendered":"https:\/\/www.purdue.edu\/newsroom\/?p=19235"},"modified":"2026-01-16T09:30:24","modified_gmt":"2026-01-16T14:30:24","slug":"purdue-deepens-semiconductor-chips-processing-ties-with-dassault-systemes-in-virtual-twin-initiative","status":"publish","type":"post","link":"https:\/\/www.purdue.edu\/newsroom\/2026\/Q1\/purdue-deepens-semiconductor-chips-processing-ties-with-dassault-systemes-in-virtual-twin-initiative","title":{"rendered":"Purdue deepens semiconductor, chips processing ties with Dassault Syst\u00e8mes in virtual twin initiative"},"content":{"rendered":"\n

WEST LAFAYETTE, Ind. \u2014 Purdue University has signed a memorandum of understanding (MOU) with Dassault Syst\u00e8mes to establish a new lab to develop virtual twin technologies for semiconductor processing and testing at Purdue\u2019s Birck Nanotechnology Center<\/a>. The MOU marks a significant step toward developing the first virtual twin-enabled semiconductor research and education platform.<\/p>\n\n\n\n

The collaboration is built upon a 2024 agreement<\/a> between Purdue and Dassault Syst\u00e8mes. Under the new MOU, the partners are collaborating on multiple projects and jointly developing sophisticated manufacturing process models and immersive extended reality experiences.<\/p>\n\n\n\n

The Semiconductor Virtual Twin Innovation Lab aims to advance virtual-first, generative technology innovation and train the next-generation semiconductor workforce. The initiative will combine immersive education, virtual process simulation and AI-guided experimentation to accelerate discovery and shorten the lab-to-fab transition.<\/p>\n\n\n\n

Under the MOU, Purdue and Dassault Syst\u00e8mes will collaborate on developing virtual twins across multiple scales and multiphysics simulations, spanning materials and reactor models through die, wafer, package, equipment and cleanroom twins.<\/p>\n\n\n\n

The initiative underscores how public-private collaboration can accelerate innovation and bring advanced technologies directly into the hands of students to unlock their creative potential.<\/p>\n\n\n\n

\u201cThis partnership brings together two leaders in semiconductor innovation and digital transformation,\u201d said Zhihong Chen, Purdue\u2019s Mary Jo and Robert L. Kirk Director of the Birck Nanotechnology Center and the Reilly Professor of Electrical and Computer Engineering. \u201cBy combining Birck\u2019s advanced semiconductor facilities with Dassault Syst\u00e8mes\u2019 powerful 3DEXPERIENCE platform, we are building a truly AI- and virtual twin-enabled research and learning environmentthat will transform how we educate, innovate and collaborate.\u201d<\/p>\n\n\n\n

Dassault Syst\u00e8mes\u2019 3DEXPERIENCE platform is a cloud-based platform that brings together design, engineering, simulation and collaboration applications into one virtual environment.<\/p>\n\n\n\n

The two organizations will engage in joint research semiconductor projects and workforce development in key areas, including new materials exploration and selection, wafer fabrication, advanced packaging, and cleanroom sustainable operations.<\/p>\n\n\n\n

\u201cOur partnership with Dassault Syst\u00e8mes is pivotal to the future of the semiconductor industry,\u201d said Luna Lu, vice president of the Office of Industry Partnerships and the Indiana ACPA Professor in Concrete Paving and Materials Science. \u201cIt creates a first-of-its-kind training environment, seamlessly moving our students from the classroom to the cleanroom to dramatically accelerate education and research.\u201d<\/p>\n\n\n\n

The move expands Purdue\u2019s growing network of global partnerships to advance semiconductor research and development while enriching student learning and advancing workforce development.<\/p>\n\n\n\n

\u201cDassault Syst\u00e8mes is committed to empowering innovation across the semiconductor ecosystem,\u201d said Bill DeVries, the company\u2019s vice president of North America brands and workforce of the future. \u201cOur collaboration with Purdue University demonstrates how virtual twins can bridge physical and digital worlds to accelerate R&D and inspire the next generation of semiconductor talent.\u201d<\/p>\n\n\n\n

Purdue\u2019s growing semiconductor innovation ecosystem is one of four key pillars of Purdue Computes<\/a>, a comprehensive initiative that also aims to position the Department of Computer Science as a top 10 national program, become a leader in the field of physical artificial intelligence, and advance quantum science and engineering to create future technologies that enable unparalleled excellence at scale.<\/p>\n\n\n\n

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