Rates

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Recharge+Rates

Effective July 1, 2020.

Service

INT

ENP/ISB

EFP

Daily Entry Fee, Birck Laboratory Access

10.00

31.00

35.00

Daily Entry Surcharge, General Labs

2.00

3.00

4.00

Daily Entry Surcharge, Bio Labs - BSL1/BSL2

6.00

13.00

15.00

Daily Entry Surcharge, 3D3C Lab - BRK 2087

18.00

33.00

37.00

Daily Entry Surcharge, Cleanroom - BRK 2100A

27.00

51.00

57.00

C - Deposition, ALD

9.00

16.00

18.00

C - Deposition, CVD

44.00

85.00

96.00

C - Deposition, PVD and Electroplating, Per Use

101.00

194.00

219.00

C - Deposition, Flex Compatible PVD, Per Use

150.00

283.00

320.00

C - Etching, General

19.00

37.00

41.00

C - Etching, ICP

57.00

110.00

124.00

C - Furnace, Oxidation/Annealing

21.00

39.00

44.00

C - Lithography, Aligners

44.00

103.00

117.00

C - Lithography, E-Beam, 100 kV

89.00

153.00

173.00

C - Lithography, Spinners

20.00

40.00

46.00

C - Metrology, General

25.00

49.00

55.00

Characterization, LDV

26.00

40.00

46.00

Characterization, Probe Station

25.00

46.00

52.00

Characterization, Spin Lab

10.00

25.00

28.00

Deposition, PLD, Per Use

400.00

620.00

701.00

Lithography, E-Beam, 30 kV

36.00

68.00

76.00

Metrology, Center for AFM

44.00

68.00

76.00

Metrology, Femtosecond and Raman

30.00

46.00

52.00

Metrology, Kratos XPS

40.00

64.00

73.00

Metrology, Omicron Surface Analysis

18.00

36.00

41.00

Metrology, Optics and Spectroscopy Lab

32.00

50.00

56.00

Metrology, Panalytical XRD

29.00

46.00

52.00

Packaging and Assembly, Advanced

37.00

71.00

80.00

Packaging and Assembly, Basic

18.00

39.00

44.00

Roll to Roll, General

112.00

196.00

221.00

Roll to Roll, Maxwell

175.00

270.00

306.00

Storeroom, BRK 2251, Per Dollar

1.00

1.88

1.88

Staff Time, Engineering

66.00

124.00

140.00

Staff Time, Lab Manager, 3D3C

51.00

79.00

89.00

Staff Time, Scientific, Center For AFM

25.00

38.00

43.00

Staff Time, Scientific, Kratos XPS

94.00

145.00

164.00

Staff Time, Scientific, Omicron Surface Analysis

94.00

145.00

164.00

Staff Time, Scientific, Optics

81.00

125.00

141.00

Staff Time, Scientific, Panalytical XRD

94.00

145.00

164.00

Staff Time, Scientific, Probe Station

88.00

136.00

153.00

Staff Time, Scientific, Roll to Roll

86.00

132.00

150.00

Staff Time, Scientific, Spin Lab

96.00

149.00

168.00

  • INT = Internal; ENP = External Academic & Non-Profit; ISB = Indiana Small Business; EFP = External For-Profit.
  • Rates are hourly unless otherwise specified in the service name.
  • “C – “ indicates services eligible for the Scifres Equipment Service Cap for internal users.
  • Facilities and Administrative (F&A) costs are included in listed external prices.
  • Precious metals are charged at market prices plus applicable markups and overhead charges.

Notes

Usage Caps (Internal Users Only)

Monthly Lab Access Cap

Charged days for each of the laboratory daily entry fees and surcharges is capped at 15 days per calendar month, per user, per account (WBSE/IO) for internal users. At the end of the fiscal year, the unrecouped portion of these costs will be transferred to each service from the Birck General Fund.

Scifres Equipment Service Cap

For internal users, a $12,000 hard cap is implemented for shared use equipment services on the Scifres cost center per user, per account (WBSE/IO), per fiscal year (by date of purchase). Any user is “uncapped” after being subsidized a total of 100% of the hard cap level ($12,000) under this cap across all their associated accounts per fiscal year (by date of purchase). Capping is done monthly by covering the costs for the affected usage from the Birck General Fund. Capped services and the tools that offer them are identified in iLab with a “C – “ at the beginning of the Category name and Schedule/Add-on name.

Staff Core Services

Any training or core services on tools by BNC engineers/scientists will be added onto the iLab calendar charge as an add-on based on the amount of actual time spent on the training/core service, rounded up to a reasonable fraction of the hour.

Definition of Indiana Small Businesses

Indiana Small Business are defined as *'s organized for profit, with a place of business located in the State of Indiana, or which makes a significant contribution to the economy of the State of Indiana through use of Indiana labor; is in the legal form of an individual proprietorship, partnership, limited liability company, corporation, joint venture, association, trust or cooperative; and has, including its affiliates, not more than 50 employees.


Charging Model for Laboratory Access Fees

Charges for access to BNC laboratories are on a per calendar day basis. The Birck Laboratory Access Daily Entry Fee (Birck Lab Fee) will be charged to users who enter any laboratory or galley within the facility. In addition to the Birck Lab Fee, daily lab consumable/support surcharges will be charged for each lab type entered:

  • Cleanroom Surcharge: Entry into the Scifres Nanofabrication Laboratory via BRK 2100A.
  • Bio Labs Surcharge: Entry into any BSL1 or BSL2 laboratory.
  • General Labs Surcharge: Entry into any laboratory or galley space not covered by the Cleanroom Surcharge or the Bio Labs Surcharge.
  • 3D3C Surcharge: Entry into the 3D Cell Culture Lab, BRK 2087, in addition to the Bio Labs Surcharge.

A user entering multiple lab types on a calendar day will pay the Birck Lab Fee only once per day (per account or approved account split) regardless of the number of lab types entered. The Surcharge for each lab type will apply only once per day (per account or approved account split) regardless of the number of different labs of that same lab type entered. It would be possible for a user to incur all four surcharge types in one day based on their usage, and no labs are charged the Birck Lab Fee without also having an associated Surcharge service.


Birck Laboratory Types

Entry into any of the rooms listed below will incur the Birck Laboratory Access Daily Entry Fee. Additional surcharges apply to each lab are listed in the “Lab Type” column.

Birck Laboratory Stocked Supplies

General Labs Stocked Supplies

  1.  Gloves
    1. Ultrasense (Deep blue) nitrile gloves
    2. Accutech latex gloves (for solvent use, cleanroom grade)
    3. Acid gloves (cleanroom grade)
  2. Wipes
    1. 1109 Techwipe cleanroom wipes
    2. Kimwipes (Small, Standard, EXL)
  3. General Chemicals
    1. Solvents
      1. Isopropanol
      2. Methanol
      3. Acetone
      4. Toluene
      5. Solvent squeeze bottles
      6. Solvent waste bottles
    2. Acids
      1. Hydrogen Peroxide
      2. Buffered Oxide Etch
      3. Hydrofluoric Acid
      4. Hydrochloric Acid
      5. Ammonium Hydroxide
      6. Sulfuric Acid
      7. Nitric Acid
      8. Phosphoric Acid
      9. Acetic Acid (Glacial)
  4. Chemical PPE
    1. Acid aprons
    2. Face shields
    3. Sharps containers
    4. Broken glass containers
    5. HF Safety Items
    6. Bottle carriers
  5. Available by request, if needed and used responsibly:
    1. Supreno (light blue) nitrile gloves
    2. Tacky mats
    3. Swiffers
    4. Hair covers
    5. Shoe covers (conductive or non-conductive)
    6. Microscope slides
    7. Pasteur pipettes
    8. Small latex bulbs
    9. Swabs
    10. UHV foil
    11. 2069 cleanroom wipes
    12. Nanofabrication solvents and optical lithography chemicals

Bio Labs Stocked Supplies

In addition to General Labs supplies:

  1. Bio specific PPE and safety items
    1. Midknight nitrile gloves (BSL1) or Sterling nitrile gloves (BSL2)
    2. Biowaste bags
    3. Soap
    4. Paper Towels
    5. Serological pipettes (3 sizes)
    6. Aspirating pipettes

Cleanroom Stocked Supplies

In addition to general lab supplies:

  1. Cleanroom Chemicals
    1. Nanofabrication Solvents
      1. Chlorobenzene
      2. HMDS
      3. Xylene
      4. PGMEA (SU8 Developer)
    2. Nanofabrication Acids/bases
      1. PRS 2000
      2. Remover PG
      3. CR-16 Chrome Etchant
      4. FE-12-CC-11 Iron Oxide Etchant
      5. Pure Strip
      6. 25% TMAH
    3. Optical Lithography Chemicals
      1. AZ Developer
      2. AZ 1518 Photoresist
      3. AZ 9260 Photoresist / AZ 10XT Photoresist
      4. AZ 400K KOH Developer
      5. MF26A Developer
    4. E-Beam Lithography Chemicals
      1. 950 PMMA and 495 PMMA EBL Resist
      2. MIBK/IPA 1:3 PMMA Developer
      3. AR-P 6200.13 EBL Resist (see Bill Rowe for details, wrowe@purdue.edu)
      4. XR-1541 HSQ EBL Resist
  2. Cleanroom supplies
    1. Many “by request” items are stocked:
      1. Hair covers
      2. Shoe covers (non-conductive)
      3. Microscope slides
      4. Pasteur pipettes
      5. Small latex bulbs
      6. Swabs
      7. UHV foil
      8. 2069 cleanroom wipes
      9. Cleanroom veils and Cleanroom M3 face masks
      10. Cleanroom paper and pens
      11. Label makers and printer labels for glassware
      12. Cleanroom tape


Birck Nanotechnology Center Recharge Rates - Comprehensive Listing

For more information on specific tools, see the tool Wiki page in the Fabrication or Characterization directory pages, or use the drop downs below. Note that tool iLab names may differ slightly from Wiki page names.

Fabrication Equipment is used for top-down nanofabrication on a variety of substrates. Included in this category is equipment used to deposit a wide variety of materials, image those materials as well as substrates, oxidize and diffuse materials, provide back-end processing, and synthesize nanoparticles using wet-chemical methods.

For new visitors, Overview of capabilities are described at the top of each topic landing page.

Thermal

Patterning

Etching

Deposition

Back-end

Bio-fabrication

Roll-to-Roll

Other Fabrication

Characterization Equipment is used to analyze materials and devices down to the nano scale. Included in this category are instruments for microscopy, surface analysis, film characterization, characterization of bulk substrates, and nanoparticle characterization.

For new visitors, Overview of capabilities are described at the top of each topic landing page.

Bio-characterization

Electrical and Magnetic Properties

Electron Microscopy

Optical Characterization

Profilometry

Roll-to-Roll Characterization

Scanning Probe Microscopy

Surface Characterization

Bio Cleanroom


TypeService NameiLab NameINTENPISBEFP
Lab AccessDaily Entry Fee, Birck Laboratory AccessBirck Lab Access Fee - Days 1 to 1510313135
Lab AccessDaily Entry Fee, Birck Laboratory AccessBirck Lab Access Fee - Days over 15 per calendar month (capped for internal users)0313135
Lab AccessDaily Entry Surcharge, 3D3C Lab - BRK 20873D3C Access Surcharge - Days 1 to 1518333337
Lab AccessDaily Entry Surcharge, 3D3C Lab - BRK 20873D3C Access Surcharge - Days over 15 per calendar month (capped for internal users)0333337
Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2BioLab Access Surcharge - Days 1 to 156131315
Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2BioLab Access Surcharge - Days over 15 per calendar month (capped for internal users)0131315
Lab AccessDaily Entry Surcharge, Cleanroom - BRK 2100ACleanroom Access Surcharge - Days 1 to 1527515157
Lab AccessDaily Entry Surcharge, Cleanroom - BRK 2100ACleanroom Access Surcharge - Days over 15 per calendar month (capped for internal users)0515157
Lab AccessDaily Entry Surcharge, General LabsGenLab Access Surcharge - Days 1 to 152334
Lab AccessDaily Entry Surcharge, General LabsGenLab Access Surcharge - Days over 15 per calendar month (capped for internal users)0334
Lab AccessStaff Time, Lab Manager, 3D3C3D3C Small Room Access Surcharge51797989
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2BASi6131315
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2Bio Confocal6131315
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2Gamry6131315
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2Laser Capture Microdissection System6131315
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2Vacuum Oven6131315
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2Zetasizer Nano6131315
Equipment - with Lab AccessDaily Entry Surcharge, Biological Labs - BSL1 and BSL2KOH Bath System6131315
Equipment - with Lab AccessDaily Entry Surcharge, Cleanroom - BRK 2100ACascade Tek TVO-2 Vacuum Oven27515157
Core ServiceStaff Time, EngineeringEngineering Staff Time66124124140
Core ServiceStaff Time, Lab Manager, 3D3C3D3C Lab Manager Staff Time51797989
Core ServiceStaff Time, Scientific, Center for AFMCenter for AFM Scientific Staff Time25383843
Core ServiceStaff Time, Scientific, Kratos XPSKratos XPS Scientific Staff Time94145145164
Core ServiceStaff Time, Scientific, Omicron Surface AnalysisOmicron Surface Analysis Scientific Staff Time94145145164
Core ServiceStaff Time, Scientific, OpticsOptics Scientific Staff Time81125125141
Core ServiceStaff Time, Scientific, Panalytical XRDPanalytical XRD Scientific Staff Time94145145164
Core ServiceStaff Time, Scientific, Probe StationProbe Station Scientific Staff Time88136136153
Core ServiceStaff Time, Scientific, Roll to RollRoll to Roll Scientific Staff Time86132132150
Core ServiceStaff Time, Scientific, Spin LabSpin Lab Scientific Staff Time96149149168
Equipment - HourlyC - Deposition, ALDC - Fiji200 ALD9161618
Equipment - HourlyC - Deposition, CVDC - 2D CVD44858596
Equipment - HourlyC - Deposition, CVDC - Tube 02 Nitride Dep44858596
Equipment - HourlyC - Deposition, CVDC - Tube 03 LTO Dep44858596
Equipment - HourlyC - Deposition, CVDC - Tube 06 Polysilicon44858596
Equipment - HourlyC - Deposition, CVDC - Tube 09 TEOS44858596
Equipment - HourlyC - Deposition, CVDC - Axic44858596
Equipment - HourlyC - Deposition, CVDC - Easy Tube 300044858596
Equipment - HourlyC - Deposition, CVDC - Parylene CVD Furnace44858596
Equipment - HourlyC - Deposition, CVDC - Plasma-Therm Apex SLR HDPCVD44858596
Equipment - HourlyC - Deposition, CVDC - Epigress44858596
Equipment - HourlyC - Etching, GeneralC - Branson Asher19373741
Equipment - HourlyC - Etching, GeneralC - March Jupiter II19373741
Equipment - HourlyC - Etching, GeneralC - March Jupiter III19373741
Equipment - HourlyC - Etching, GeneralC - Xactix E1 Xenon Difluoride (XeF2) Etcher19373741
Equipment - HourlyC - Etching, ICPC - AJA Ion Mill57110110124
Equipment - HourlyC - Etching, ICPC - Panasonic E620 ICP RIE Etcher57110110124
Equipment - HourlyC - Etching, ICPC - STS AOE57110110124
Equipment - HourlyC - Etching, ICPC - STS ASE 257110110124
Equipment - HourlyC - Etching, ICPC - Plasma Therm APEX SLR57110110124
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Blue M Furnace21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Jipelec RTA21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Nitric Oxide Anneal21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Nitrogen Anneal Furnace21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - RCA Hood21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Tube 01 Clean Ox21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Tube 04 Field Ox21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Tube 05 Anneal21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Tube 07 General Ox21393944
Equipment - HourlyC - Furnace, Oxidation/AnnealingC - Tube 08 Phos Drive21393944
Equipment - HourlyC - Lithography, AlignersC - 557 MJB3 Aligners44103103117
Equipment - HourlyC - Lithography, AlignersC - Heidelberg MLA150 Maskless Aligner44103103117
Equipment - HourlyC - Lithography, AlignersC - MA644103103117
Equipment - HourlyC - Lithography, AlignersC - MJB3_1 and MJB3_244103103117
Equipment - HourlyC - Lithography, AlignersC - MJB444103103117
Equipment - HourlyC - Lithography, AlignersC - Nanonex NX-200044103103117
Equipment - HourlyC - Lithography, AlignersC - SB6e bonder44103103117
Equipment - HourlyC - Lithography, E-Beam, 100 kVC - JEOL JBX-8100FS E-Beam Writer89153153173
Equipment - HourlyC - Lithography, SpinnersC - Laurell EDC-650 Spin Processor20404046
Equipment - HourlyC - Lithography, SpinnersC - Spinner1 and Spinner220404046
Equipment - HourlyC - Lithography, SpinnersC - Spinner320404046
Equipment - HourlyC - Metrology, GeneralC - Leica Confocal System25494955
Equipment - HourlyC - Metrology, GeneralC - Olympus BX-60 Microscope (J Bay)25494955
Equipment - HourlyC - Metrology, GeneralC - Olympus BX-51 Microscope (P Bay)25494955
Equipment - HourlyC - Metrology, GeneralC - Nikon Eclipse L150 Microscope #1 (N bay)25494955
Equipment - HourlyC - Metrology, GeneralC - Nikon Eclipse L150 Microscope #2 (N bay)25494955
Equipment - HourlyC - Metrology, GeneralC - Keyence VHX-6000 Digital Microscope25494955
Equipment - HourlyC - Metrology, GeneralC - Alpha-Step25494955
Equipment - HourlyC - Metrology, GeneralC - Bruker GT-K25494955
Equipment - HourlyC - Metrology, GeneralC - Cleanroom Ellipsometer25494955
Equipment - HourlyC - Metrology, GeneralC - DI3100 BRK126525494955
Equipment - HourlyC - Metrology, GeneralC - Filmetrics F10-RT25494955
Equipment - HourlyC - Metrology, GeneralC - Filmetrics F40-UV25494955
Equipment - HourlyC - Metrology, GeneralC - Nanoman AFM25494955
Equipment - HourlyC - Metrology, GeneralC - P-7 Profilometer25494955
Equipment - HourlyC - Metrology, GeneralC - Stress Machine25494955
Equipment - HourlyC - Metrology, GeneralC - TA Instruments DHR3 Rheometer25494955
Equipment - HourlyCharacterization, LDVPolytec Laser Vibrometer26404046
Equipment - HourlyCharacterization, LDVSuss PLV50 ProbeStation26404046
Equipment - HourlyCharacterization, Probe StationCleanroom Probe 125464652
Equipment - HourlyCharacterization, Probe StationJandel 4-point Probe25464652
Equipment - HourlyCharacterization, Probe StationMMR Probe25464652
Equipment - HourlyCharacterization, Probe StationProbe 125464652
Equipment - HourlyCharacterization, Probe StationProbe 225464652
Equipment - HourlyCharacterization, Spin LabMPMS10252528
Equipment - HourlyCharacterization, Spin LabPPMS10252528
Equipment - HourlyLithography, E-Beam, 30 kVRaith eLine E-Beam Writer36686876
Equipment - HourlyMetrology, Center for AFMAsylum MFP 3D Bio 44686876
Equipment - HourlyMetrology, Center for AFMAsylum_Cypher_BRK44686876
Equipment - HourlyMetrology, Center for AFMNanotecAFM144686876
Equipment - HourlyMetrology, Center for AFMNanotecAFM244686876
Equipment - HourlyMetrology, Center for AFMBruker Catalyst AFM44686876
Equipment - HourlyMetrology, Femtosecond and RamanCoherent Legend FS30464652
Equipment - HourlyMetrology, Femtosecond and RamanHoriba LabRAM HR30464652
Equipment - HourlyMetrology, Kratos XPSKratos AXIS Ultra DLD Imaging X-ray Photoelectron Spectrometer (XPS)40646473
Equipment - HourlyMetrology, Omicron Surface AnalysisOmicron Surface Analysis Cluster: UHV STM/AFM, XPS, LEED, HREELS, metal deposition18363641
Equipment - HourlyMetrology, Optics and Spectroscopy LabLambda 95032505056
Equipment - HourlyMetrology, Optics and Spectroscopy LabNSOM Renishaw32505056
Equipment - HourlyMetrology, Optics and Spectroscopy LabSpitfire-topas32505056
Equipment - HourlyMetrology, Optics and Spectroscopy LabT64000 Raman32505056
Equipment - HourlyMetrology, Optics and Spectroscopy LabVASE Ellipsometer32505056
Equipment - HourlyMetrology, Optics and Spectroscopy LabVector 2232505056
Equipment - HourlyMetrology, Panalytical XRDXRD29464652
Equipment - HourlyPackaging and Assembly, AdvancedDiscoDad37717180
Equipment - HourlyPackaging and Assembly, AdvancedDiscoDad 237717180
Equipment - HourlyPackaging and Assembly, AdvancedJFP Wire Bonder37717180
Equipment - HourlyPackaging and Assembly, AdvancedLPKF Mill37717180
Equipment - HourlyPackaging and Assembly, AdvancedLPKF Plater37717180
Equipment - HourlyPackaging and Assembly, AdvancedLPKF Press37717180
Equipment - HourlyPackaging and Assembly, AdvancedPick and Place37717180
Equipment - HourlyPackaging and Assembly, AdvancedWestbond 7400A37717180
Equipment - HourlyPackaging and Assembly, AdvancedWestbond 7476E37717180
Equipment - HourlyPackaging and Assembly, BasicASAP-1 IPS Digital Sample Preparation System18393944
Equipment - HourlyPackaging and Assembly, BasicCPD18393944
Equipment - HourlyPackaging and Assembly, BasicULS PLS6MW Laser Engraver18393944
Equipment - HourlyPackaging and Assembly, BasicFuji Inkjet18393944
Equipment - HourlyRoll to Roll, GeneralLasX112196196221
Equipment - HourlyRoll to Roll, GeneralMirwec112196196221
Equipment - HourlyRoll to Roll, GeneralMPS TF-100 Screen Printer112196196221
Equipment - HourlyRoll to Roll, GeneralPPSI_Inkjet112196196221
Equipment - HourlyRoll to Roll, MaxwellMaxwell Roll to Roll System175270270306
Equipment - Per UseC - Deposition, Flex Compatible PVD, Per UseC - Lesker E-Beam Evaporator - Flexible Substrate Compatible150283283320
Equipment - Per UseC - Deposition, Flex Compatible PVD, Per UseC - PVD Sputtering System - Flexible Substrate Comparible150283283320
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - CHA E-Beam Evaporator #1101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - CHA E-Beam Evaporator #2101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - Leybold E-Beam Evaporator101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - PVD E-Beam Evaporator - Metal/Magnetic Sources101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - PVD E-Beam Evaporator - Glancing Angle Deposition (GLAD)101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - PVD Sputtering System - 4 Target Magnetic Sources101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - PVD Sputtering System - Metal/Dielectric Sources101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - PVD Sputtering System - Nitride101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - Iko Electroplating System101194194219
Equipment - Per UseC - Deposition, PVD and Electroplating, Per UseC - WAFAB Electroplating System101194194219
Equipment - Per UseDeposition, PLD, Per UsePVD Pulsed Laser Deposition (PLD) System400620620701
Equipment - Per UseStaff Time, Scientific, Kratos XPSGlovebox94145145164
Equipment - Per UseStaff Time, Scientific, Kratos XPSKratos XPS Glovebox94145145164
Materials - BRK 2251 StoreroomStoreroom, BRK 2251Store Room Service ChargeMarketMarket + 89%Market + 89%Market + 89%
Materials - PassthroughStaff Time, EngineeringCore Service Passthrough ChargeMarketMarket + 55%Market + 55%Market + 55%
Materials - PassthroughStaff Time, Engineering4 x 4 Inch Chrome photomask blank (409Cr)MarketMarket + 55%Market + 55%Market + 55%
Materials - PassthroughStaff Time, Engineering4 x 4 Inch Iron Oxide photomask blank (409Fe)MarketMarket + 55%Market + 55%Market + 55%
Materials - PassthroughStaff Time, Engineering5 x 5 Inch Chrome photomask blank (809Cr)MarketMarket + 55%Market + 55%Market + 55%
Materials - PassthroughStaff Time, Engineering5 x 5 Inch Iron Oxide photomask blank (409Cr)MarketMarket + 55%Market + 55%Market + 55%
Materials - PassthroughStaff Time, EngineeringPhotomask CaseMarketMarket + 55%Market + 55%Market + 55%
Materials - PassthroughStaff Time, Lab Manager, 3D3C3D3C Collaboration ProjectMarketMarket + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesAg (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesAl (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesAl2O3 (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesCo (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesEr (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesFe (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesGe (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesITO (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesMn (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesMo (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesNb (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesNi (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesNi/Cr (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesPy (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesSi (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesSiO2 (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesTa (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesTa2O5 (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesTi (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Evaporating, CommonEvaporating Material - Storeroom, PVD SourcesTiO2 (per nanometer) - Evaporating0.10.190.190.19
Materials - PVD: Sputtering, CommonNitride Material - Storeroom, PVD SourcesAl (per nanometer) - Nitride0.160.310.310.31
Materials - PVD: Sputtering, CommonNitride Material - Storeroom, PVD SourcesCr (per nanometer) - Nitride0.160.310.310.31
Materials - PVD: Sputtering, CommonNitride Material - Storeroom, PVD SourcesSc (per nanometer) - Nitride0.160.310.310.31
Materials - PVD: Sputtering, CommonNitride Material - Storeroom, PVD SourcesTi (per nanometer) - Nitride0.160.310.310.31
Materials - PVD: Sputtering, CommonNitride Material - Storeroom, PVD SourcesZr (per nanometer) - Nitride0.160.310.310.31
Materials - PVD: Sputtering, CommonPLD Material - Storeroom, PVD SourcesAl (per nanometer) - PLD0.160.310.310.31
Materials - PVD: Sputtering, CommonPLD Material - Storeroom, PVD SourcesCr (per nanometer) - PLD0.160.310.310.31
Materials - PVD: Sputtering, CommonPLD Material - Storeroom, PVD SourcesSc (per nanometer) - PLD0.160.310.310.31
Materials - PVD: Sputtering, CommonPLD Material - Storeroom, PVD SourcesTi (per nanometer) - PLD0.160.310.310.31
Materials - PVD: Sputtering, CommonPLD Material - Storeroom, PVD SourcesZr (per nanometer) - PLD0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesAg (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesAl (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesAl1%Si (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesAl2O3 (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesCo (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesCoFeB (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesCr (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesCu (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesFe (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesGe (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesITO (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesMgO (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesMn (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesMo (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesNb (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesNi (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesNi/Cr (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesPy (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesRu (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesSi (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesSi3N4 (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesSiC (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesSiO2 (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesTa (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesTa2O5 (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesTi (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesTiO2 (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesW (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Sputtering, CommonSputtering Material - Storeroom, PVD SourcesZr (per nanometer) - Sputtering0.160.310.310.31
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesAu (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesB (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesCr (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesCu (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesPd (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesPt (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Evaporating, PreciousEvaporating Material - Storeroom, PVD SourcesSc (per nanometer) - EvaporatingMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Sputtering, PreciousSputtering Material - Storeroom, PVD SourcesAu (per nanometer) - SputteringMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Sputtering, PreciousSputtering Material - Storeroom, PVD SourcesB (per nanometer) - SputteringMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Sputtering, PreciousSputtering Material - Storeroom, PVD SourcesEr (per nanometer) - SputteringMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Sputtering, PreciousSputtering Material - Storeroom, PVD SourcesPd (per nanometer) - SputteringMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Sputtering, PreciousSputtering Material - Storeroom, PVD SourcesPt (per nanometer) - SputteringMarket - 18%Market + 55%Market + 55%Market + 55%
Materials - PVD: Sputtering, PreciousSputtering Material - Storeroom, PVD SourcesSc (per nanometer) - SputteringMarket - 18%Market + 55%Market + 55%Market + 55%