Heatpulse 610

Printable version

Heatpulse 610 Heatpulse 610

General Information

FIC: Shared

Owner: Dan Holser

Location: Cleanroom R Bay

Max Wafer Size: 4 inch (100 mm)

System Information

General Description

The Heatpulse 610 RTA is a small, benchtop rapid thermal processing machine used for a wide range of experiments, thus, contamination and cleanliness is not controlled.

Capabilities

  • Capable of simple time at elevated temperature experiments for short time intervals
  • Steady state process time can be set from 1 second to a maximum of 5 minutes
  • Steady state temperature can be set from 300 to 800°C
  • Process gases include N2, O2, and Forming Gas

Materials Compatibility

Not Applicable

Notes

Please note: Not capable of long process runs at high temperatures

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.