Heatpulse 610

Return to Equipment at Birck Nanotechnology Center

Heatpulse 610 Heatpulse 610

General Information

FIC: Shared

Owner: Dan Holser

Location: Cleanroom R Bay

Max Wafer Size: 4 inch (100 mm)

System Information

General Description

The Heatpulse 610 RTA is a small, benchtop rapid thermal processing machine used for a wide range of experiments, thus, contamination and cleanliness is not controlled.


Materials Compatibility

Not Applicable


Please note: Not capable of long process runs at high temperatures