Pyrogenic Oxidation

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General Information

FIC: Various

Owner: Dan Hosler

Location: Cleanroom R Bay

Max Wafer Size: 3 inch (75 mm)

System Information

General Description

Thermal oxidation by pyrogenically combining O2 and H2.


~Process gases include Hydrogen, Oxygen, Nitrogen, and Argon. ~Able to achieve temperatures of 1100°C

Materials Compatibility

Silicon substrates only


Due to cleanliness and contamination concerns, this furnace tube is limited use

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* Must use iLab and be a trained user to reserve a slot on this system.