Suss SB6e Substrate Bonder

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Suss SB6e Substrate Bonder

General Information

iLab Name: SB6e bonder

iLab Core: BRK Lithography Core

FIC: David Janes

Owner: Mike Courtney

Location: Cleanroom N Bay

Max Wafer Size: 4

System Information

General Description

The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are mechanically clamped using the transport fixture for further processing in the SB6e chamber.


4 inch wafer size for bonding Vacuum down to 5x10-5 mbar. Over pressure up to 3 bar absolute Flexible process control using Windows NT with data recording and analysis Optimized bonding routines can be replicated

Materials Compatibility

Not Applicable

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* Must use iLab and be a trained user to reserve a slot on this system.