Hotplate Bonder

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Hotplate Bonder

General Information

FIC: Tim Sands

Owner: Nithin Raghunathan

Location: BRK 1217

System Information

General Description

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes


Sample size 4” diameter wafer maximum 2 independently controlled hot plates Temperature 400°C maximum Force sensor 999lbs maximum Enclosure for inert gas ambient Water cooling for quick cycling of samples 2” adapter available for improving pressure uniformity

Materials Compatibility

Not Applicable

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.