Plasma Tech RIE

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Plasma Tech RIE

General Information

iLab Name: Plasmatech

iLab Core: BRK Etch Core

FIC: Shared

Owner: Sean Rinehart

Location: Cleanroom Bay K

Max Wafer Size: 6

System Information

General Description

This plasma system is used to etch Si, SiO2, SiC, SiN, polymers, and materials not readily stripped by the Branson.


The Plasma Tech RIE system etches using Ar, SF6, and O2. The base pressure is less than 5 mTorr. Maximum recommended power is 200 W.

Materials Compatibility

Not Applicable

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.