PVD Sputterer - Six Pocket Magnetics

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PVD Sputterer - Six Pocket Magnetics

General Information

FIC: Joerg Appenzeller

Owner: Dave Lubeski

Location: Cleanroom Bay S

Max Wafer Size: 4"

System Information

General Description

Magnetic Sputtering System

Capabilities

DC/RF Sputtering System, Base pressure of 5x10-8 Torr, reactive sputtering capable, Heated and RF Biased Rotating Substrate Stage capable of 850C.  Materials include: Cu, CO, CoCrPt, W, NiO and Al2O3.

Materials Compatibility

Cu, Co, CoCrPt, W, NiO, Al2O3, Ta, Ru, MgO, NiFe, Py, CoFeB

No Organic/Flexible Materials Allowed

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.