Nitride sputter system

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Nitride sputter system

General Information

iLab Name: Nitride Sputtering

iLab Core: BRK Evaporation/Sputtering Core

FIC: Vlad Shalaev

Owner: Dave Lubelski

Location: BRK 1217

Max Wafer Size: 2

System Information

General Description

  • Versatile sputtering system for the deposition of metals and nitrides
  • Manufacturer: PVD Products, Inc.


  • samples up to 2” diameter wafers
  • max substrate temperature
    • sapphire = 800°C
    • silicon = 900°C
  • targets
    • four 2” magnetron sputter sources
    • current available targets: Ag, Al, Co, Cr, Cu, Fe, Fe-Al, Ga, In, Mo, Sc, Ta, TaN, Ti, TiN, V, W, Zr, ZrN
  • gases: Ar, N2, NH3
  • power supplies
    • three 500W DC power supplies
    • one 13.54 MHz, 300W RF power supply
  • chamber
    • loadlock
    • base pressure <8x10-8 Torr
    • two quartz crystal monitors for in-situ thickness measurement

Materials Compatibility

Not Applicable

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.