Oxide PLD system

Printable version

Access iLab page

Oxide PLD system

General Information

iLab Name: PLD

iLab Core: BRK Evaporation/Sputtering Core

FIC: Alexandra Boltasseva

Owner: Dave Lubelski

Location: BRK 1217

Max Wafer Size: 2

System Information

General Description

Versatile pulsed laser deposition system dedicated to oxides Manufacturer: PVD Products, Inc.


  • Samples up to 2” diameter wafers
  • Max substrate temperature
    • sapphire = 800°C
    • silicon = 900°C
  • heating via IR lamps
  • Targets
    • three 2” dia. x 0.25” thick target holders
    • smaller target sizes possible
    • current available targets: Ag, Al, Co, Cr, Cu, Fe, Ga, In, Mo, Sc, Ta, Ti, V, W, Zr
  • Gases: O2
  • Laser source
    • Lambda Physik 305i KrF excimer laser (see manual below)
    • Laser rastering
    • uniform rastering across target via rotation and mirror
  • Chamber
    • loadlock
    • base pressure <810-8 Torr

Materials Compatibility

Non-outgassing materials

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.