Logitech Chemical Delayering and Planarization System

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Logitech Chemical Delayering and Planarization System

General Information

FIC: Shared

Owner: Geoff Gardner

Location: 2031

Max Wafer Size: 8 in.

System Information

General Description

Chemical mechanical polisher (CMP) used to polish and planarize wafers and piece-parts. Can be used for both metals and dielectrics.

Capabilities

8" diameter wafer to single IC capability Automated process control for repeatable results Various process parameters such as: platen rotational speed; carrier rotational speed, down force, and back pressure; carrier sweep speed and linear travel; platen temperature; slurry flow rate; in situ conditioning of polishing pad

Materials Compatibility

Misc.

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.