Chemical Mechanical Polisher

Printable version

Chemical Mechanical Polisher

General Information

FIC: Shared

Owner: Joon Park

Location: BRK 2031

System Information

General Description

This Logitech Chemical Mechanical Polishing System can be used for planarization of samples up to 8" in diameter. This process uses abrasive and corrosive chemical slurries along with mechanical polishing to smooth the surface. This tool has independent control for; main plate speed, carrier speed, slurry feed rate, head force plate temperature.

Materials Compatibility

Not Applicable


All materials to be processed must be approved by Geoff Gardner & Steve Jurss. Consumable materials such as polishing pads and slurries may need to be purchased by the user.

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.