Thin Film Stress Machine

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Thin Film Stress Machine

General Information

iLab Name: Stress Machine

iLab Core: BRK Metrology Core

FIC: Shared

Owner: Dan Hosler

Location: Cleanroom S Bay

Max Wafer Size: 8 inch (200 mm)

System Information

General Description

The Thin Film Stress Machine is a non-destructive testing tool used to analyze the stress of thin films. The stress machine analyzes the radius of curvature of your whole wafer prior to the film being deposited. Then after film deposition, the stress machine reanalyzes your sample to compare to the original. This change in radius of curvature will then result in a film stress value in the units of MPa.

Capabilities

  • Capable of 3, 4, 5, 6, and 8 inch whole wafers
  • Can measure film stress from ambient to 500°C
  • Can measure film stress over a period of time
  • Capable of graphing time vs stress, and temp vs stress
  • Capable of measuring deflection of the substrate
  • Nitrogen reduces oxidation during heating
  • CDA can assist in cooling

Materials Compatibility

Not Applicable

Notes

You must know your substrate thickness and film thickness to achieve a proper stress value

Useful Links

* Must use iLab and be a trained user to reserve a slot on this system.