"Experiments and Models Regarding Strain Dependent Thermal Conductivity and Strength...."
April 29 @ 3:00 PM - 4:00 PM - Birck 1001
Abstract:
Silicon micro- and nano-structures are essential in today’s integrated circuits and sensors. The functioning and performance of such devices are highly affected by thermal properties. Due to the size effect, the thermal properties of bulk silicon cannot represent those of silicon micro-structures. Furthermore, stress/strain inside the silicon structures can have a significant effect on their thermal properties.
Contact Details
- Bonnie Kauffman
- kauffmab@purdue.edu
- 765-496-6298