Birck Nanotechnology Center

User Manuals

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Chemical Vapor Deposition
AXIC PECVD
Tempress 280 LPCVD Furnaces

Dry Etch
Branson Series 3000 Barrel Etcher
LAM Triode Etcher
Plasma Technology RIE
Semi Group Reactive Ion Etcher

Electron Beam Lithography
Cambridge Electron Beam Microfabricator 2.5
JEOL/Nabity E-beam Lithography System

Epitaxy
Centura Cluster Tool

Ion Implantation
AIM 210 Ion Implanter
Extrion Ion Implanter

Metal Deposition
Airco Temescal FDC 1800 Electron Beam Evaporator
CHA Electron Beam Evaporator
Leybold/Homebrew Electron Beam Evaporator
MRC 8620 Sputter System
MRC 903 Sputter System
NRC 3114 Thermal Evaporator
Perkin-Elmer 2400 Sputter System
Varian Electron-Beam Evaporator

Optical Lithography
Canon PLA501F 4" Mask Aligner
Karl Suss MA-24 Mask Aligner - EE
Karl Suss MJB-3 Mask Aligner - EE
Karl Suss MJB-3 Mask Aligner - MSEE

Oxidation and Diffusion
Tempress 280 Oxidation and Diffusion Furnaces

Photomask Generation
HP 650 Inkjet Printer
IC Layout Workstations
Electromask TRE Platemaker
Ultratech Contact mask copier
Florod Laser Mask Repair System

Ultrapure Water
DeIonized Water System, EE Building

Wafer Cutting and Dicing
Tempress 602 Dicing Saw
Kulicke & Soffa 797 Dicing Saw

Wire Bonding
West Bond Thermosonic bonder
Kulicke & Soffa 4526 Ribbon Bonder
Kulicke & Soffa Ball Bonder

 

 

Facilities