Equipment Listing

New rates effective June 2009. See specific equipment page for details.

AFM

• Veeco Dimension AFM

Anodization

• Anodization

Atomic Layer Deposition

• Atomic Layer Deposition

Biology

Conventional Thermal Processing

• Ammonia Anneal
• Blue M Oven
• Horizontal Furnace
• Nitric Oxide Anneal
• Pyrogenic Oxidation

Dry Etching

• Plasma RIE Etching Fundamentals and Applications (PDF)
• Branson Asher
• Panasonic E620 Etcher
• Plasma Tech RIE
• STS ASE DRIE
• STS AOE DRIE
• Xenon Difluoride Etch
  

E-beam Evaporation

• Airco E-beam Evaporator
• CHA E-beam Evaporator
• Leybold E-beam Evaporator
• Varian E-beam Evaporator

E-beam Lithography

• Vistec VB6

Electrodeposition

• Electrodeposition (BASi)
• Electrodeposition (Princeton Applied)

FIB

Field Emission Vacuum

FTIR

Hall Effect

• Hall Effect MMR

Imaging Interferometer

Metalorganic CVD

• Epigress
• OMVPE - Aixtron

Molecular Beam Epitaxy

• Molecular Beam Epitaxy Growth System

Optical Photolithography

• Canon PLA-501F Wafer Aligner
• Suss MJB-3 Wafer Aligner
• Suss MA 6 Mask Aligner
  

Photomask Generation

• Electromask System

 

Plasma Enhanced CVD

• Axic PECVD
• Carbon Nanotube PECVD

Polishing & Planarization

Probe Stations

• Probe Station I
• Probe Station II
• Probe Station III

Rapid Thermal Processing

• Heatpulse 610
• Minipulse RTA

SEM

• FEI Nova 200 NanoLab DualBeamTM-SEM/FIB
• Hitachi S-4800 Field Emission SEM

Sputtering Systems

• Anatech Sputterer
• Nitride sputter system
• Perkin Elmer 2400 Sputterer

STM

Surface Analysis

• Cleanroom Ellipsometer
• Filmetrics
• Olympus BX-60
• Stokes Ellipsometer

Surface Profilometry

• Alpha-Step IQ

TEM

• Titan 80-300 kV Environmental Electron Microscope

Thermal Evaporation

• Vecco Thermal Evaporator

Vapor Phase Epitaxy

• HVPE

Wafer Bonding

• Suss SB6e Substrate Bonder

Wafer Cutting & Dicing

• Disco DAD-2H/6 Dicing Saw

Wet Chemical Processing

• Chemical Fume Hoods

Wire Bonding

• Wire bonder

XPS

• Kratos X-ray Photoelectron Spectrometer

XRD

• XRD

Other/Not Listed

• Contact Annealer
• Critical point dryer (CPD)
• Desk-Top Precision Spin Coating System
• DynaPro99 Dynamic Light Scattering
• Hotplate Bonder
• Laser lift-off and laser annealing
• Oxide PLD system
• Parylene CVD
• PL Cryostat
• Raith e_LiNE
• Thin Film Stress Machine
• Ultrapure Water System
• UV flood curing system

 

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Completed Forms: jgoecker@purdue.edu