Birck Nanotechnology Center

Chemical Mechanical Polisher

General Informationmbe

Equipment Name: Chemical Mechanical Polisher

Coral Name: CMP

FIC: Shared

Process/Equipment Owner:

Geoff Gardner

Location: BRK 2031

 

System Information

General Description:

This Logitech Chemical Mechanical Polishing System can be used for planarization of samples up to 8" in diameter. This process uses abrasive and corrosive chemical slurries along with mechanical polishing to smooth the surface. This tool has independent control for;
main plate speed,
carrier speed,
slurry feed rate,
head force
plate temperature.

 

Comments:

All materials to be processed must be approved by Geoff Gardner & Steve Jurss. Consumable materials such as polishing pads and slurries may need to be purchased by the user.

 

Useful System Links

Equipment Use Fees      

 

Facilities