Chemical Mechanical Polisher
General Information
Equipment Name: Chemical Mechanical Polisher
Coral Name: CMP
FIC: Shared
Process/Equipment Owner:
Location: BRK 2031
System Information
General Description:
This Logitech Chemical Mechanical Polishing System can be used for planarization of samples up to 8" in diameter. This process uses abrasive and corrosive chemical slurries along with mechanical polishing to smooth the surface. This tool has independent control for;
main plate speed,
carrier speed,
slurry feed rate,
head force
plate temperature.
Comments:
All materials to be processed must be approved by Geoff Gardner & Steve Jurss. Consumable materials such as polishing pads and slurries may need to be purchased by the user.
Useful System Links
Equipment Use Fees