Birck Nanotechnology Center

Wire bonder

General Information

Equipment Name: Wire bonder

Coral Name: kns4526

FIC: David Janes

Process/Equipment Owner: Dave Lubelski

Location: brk2261


Gale Lockwood

wb1 wb2

System Information

General Description:

-Both systems use gold wire to bond. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

System Capabilities:

-The West Bond bonder has 25 micron gold wire and is operated manually. The K&S bonder has a wire size of 125 microns by 25 microns and may be operated manually or by programming. The pads must be larger than the size of a wire bond foot. Wire bond feet are typically 50 microns in width and 75 microns long. The recommended pads are 100 x100 microns minimum size on both chip and package for the West Bond. 100 x 150 microns for the K&S Ribbon Bonder.

General Comments:

-This bonder is not for general use. Packages must be submitted to Gale Lockwood for Bonding. Gale's work hours are Monday and Thursday's from 12pm till 3pm or by appointment. Gale can be reached at 231-357-2263 or

Useful System Links

Equipment Use Fees
Reserve System*
*Must install Coral and be a trained user to reserve a slot on this system.



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