Suss SB6e Substrate Bonder
Equipment Name: Suss SB6e Substrate Bonder
Coral Name: sb-6e_bonder
FIC: David Janes
Process/Equipment Owner: Mike Courtney
Location: Cleanroom N Bay
Max Wafer Size: 4
General Description: The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are either mechanically clamped using the transport fixture or laser-welded for further processing in the SB6e chamber.
System Capabilities: 4 inch wafer size for bonding Vacuum down to 5x10e-5 mbar. Over pressure up to 3 bar absolute Flexible process control using Windows NT with data recording and analysis Optimized bonding routines can be replicated
Useful System LinksEquipment Use Fees
*Must install Coral and be a trained user to reserve a slot on this system.