Birck Nanotechnology Center

Suss SB6e Substrate Bonder

General Information

Equipment Name: Suss SB6e Substrate BonderSuss

Coral Name: sb-6e_bonder

FIC: David Janes

Process/Equipment Owner: Mike Courtney

Location: Cleanroom N Bay

Max Wafer Size: 4

System Information

General Description: The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are either mechanically clamped using the transport fixture or laser-welded for further processing in the SB6e chamber.

System Capabilities: 4 inch wafer size for bonding Vacuum down to 5x10e-5 mbar. Over pressure up to 3 bar absolute Flexible process control using Windows NT with data recording and analysis Optimized bonding routines can be replicated

Useful System Links

Equipment Use Fees
Reserve System*
Schedule Training
 
*Must install Coral and be a trained user to reserve a slot on this system.

 

Documentation

Operators Manual

Facilities