Birck Nanotechnology Center

Suss MA 6 Mask Aligner

General Information

Equipment Name: Suss MA 6 Mask AlignerMA6

Coral Name: ma_6

FIC: David Janes

Process/Equipment Owner: Mike Courtney

Location: Cleanroom N Bay

Max Wafer Size: 6

 

System Information

General Description: The Suss MA 6 Aligner is designed for high resolution photolithography in a clean room environment. It offers unsurpassed flexibility in the handling of substrates of differing thickness, as well as standard 4 inch size wafers.

Comments: With the Suss MA 6 operated manually, all contact exposure programs (vacuum, hard, soft,contact and proximity) are provided to print features far into the submicron range. X and Y shift are below 0.1 micron and not detectable by optical means. Wafers up to 6 mm thickness may be processed.

Useful System Links

Equipment Use Fees
Reserve System*
Schedule Training
 
*Must install Coral and be a trained user to reserve a slot on this system.

  

Documentation

Operators Manual pdf

Facilities