Birck Nanotechnology Center

Thin Film Stress Machine

General Information

Equipment Name: Thin Film Stress Machine

Coral Name: stress_machine

FIC: Shared

Process/Equipment Owner: Dan Hosler

Location: Cleanroom S Bay

Max Wafer Size: 8

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System Information

General Description:

A tool used to analyze the stress of thin films.
- Capable of 3, 4, 5, 6, and 8 inch wafers
- Measures stress in units of MPA or Dynes per square centimeter
- Non-destructive testing using a laser that measures radius of curvature of your substrate.

System Capabilities:

- Capable of measuring stress from ambient to 500°C
- Capable of measuring stress over a period of time.
- Capable of graphing time vs stress, and temp vs stress.
- Capable of measuring deflection of the substrate.
- Has Nitrogen to reduce oxidation during heating.
- Has CDA to assist in cooling.

Useful System Links

Equipment Use Fees
Reserve System*
Schedule Training
 
*Must install Coral and be a trained user to reserve a slot on this system.

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