Birck Nanotechnology Center

Plasma Tech RIE

General Information

Equipment Name: Plasma Tech RIEplasma

Coral Name: plasma_tech

FIC: Shared

Process/Equipment Owners:

Geoff Gardner
Bill Sheldon

Location: Cleanroom Bay K

Max Wafer Size: 6

System Information

General Description: This system is used to dry etch different substrates such as Si, SiO2, SiC, SiN, and polymers.

Capabilities: The Plasma Tech RIE system uses Ar, O2, and SF6 gases for etching. The base pressure is less than 0.1mTorr. The system consists of a process chamber, main unit, RF generator, pressure gauge, turbo pump controller, and automatic pressure controller.

Useful System Links

Equipment Use Fees
Reserve System*
Schedule Training
 
*Must install Coral and be a trained user to reserve a slot on this system.

  

Documentation

Operators Manual pdf

Facilities