Plasma Tech RIE
Equipment Name: Plasma Tech RIE
Coral Name: plasma_tech
Location: Cleanroom Bay K
Max Wafer Size: 6
General Description: This system is used to dry etch different substrates such as Si, SiO2, SiC, SiN, and polymers.
Capabilities: The Plasma Tech RIE system uses Ar, O2, and SF6 gases for etching. The base pressure is less than 0.1mTorr. The system consists of a process chamber, main unit, RF generator, pressure gauge, turbo pump controller, and automatic pressure controller.
Useful System LinksEquipment Use Fees
*Must install Coral and be a trained user to reserve a slot on this system.