Birck Nanotechnology Center

Panasonic E620 Etcher

General Informationcontact

Equipment Name: Panasonic E620 Etcher

Coral Name: panasonic

FIC: Masa Rao

Process/Equipment Owners:

Geoff Gardner
Bill Sheldon

Location: Cleanroom-Bay K

Max Wafer Size: 6

 

System Information

General Description:

This system use reactive ion etching techniques to anisotropically etch a wide variety of substrates.

System Capabilities:

The Panasonic E620 is a dry etching system which generates up to 1250 watt inductively coupled RF plasma at 13.56 Mhz and up to a 600 watt capacitive bias for highly anisotropic etches. It has the ability use, Ar/CHF3 and CF4/SF6 on shared gas lines, Cl2, N2, O2, and BCl3 as process gasses, allowing for etching of a large variety of materials.

The E620 accepts single flat 6” wafers and uses an electrostatic chuck along with helium backside cooling. Additional features include end point monitoring, error logging and a simple interface with storage for 99 recipes.

Note:

  • Gold and platinum are not to be processed in the Panasonic.
  • There is a 100g weight limit for the wafer to be loaded into the system.
  • Any new materials or use of BCl3 must be approved by BNC Staff

Useful System Links

Equipment Use Fees
Reserve System*
Schedule Training
 
*Must install Coral and be a trained user to reserve a slot on this system.

  

Documentation

Panasonic Operating Instructions

Facilities