Birck Nanotechnology Center

Nitride Sputter System

General Information

Equipment Name: Nitride sputter systemAxitron

Coral Name: nitride_sputtering

FIC: Tim Sands

Process/Equipment Owner: Jeremy Schroeder

Location: BRK 1217

Max Wafer Size: 2

 

System Information

General Description:

  • Versatile sputtering system for the deposition of metals and nitrides
  • Manufacturer: PVD Products, Inc.

System Capabilities:

  • samples up to 2” diameter wafers
  • max substrate temperature
    • sapphire = 800°C
    • silicon = 900°C
  • targets
    • four 2” magnetron sputter sources
    • current available targets: Ag, Al, Co, Cr, Cu, Fe, Fe-Al, Ga, In, Mo, Sc, Ta, TaN, Ti, TiN, V, W, Zr, ZrN
  • gases: Ar, N2, NH3
  • power supplies
    • three 500W DC power supplies
    • one 13.54 MHz, 300W RF power supply
  • chamber
    • loadlock
    • base pressure <8x10-8 Torr
    • two quartz crystal monitors for in-situ thickness measurement

General Comments:

  • No photoresist allowed in system

Useful System Links

Equipment Use Fees
Reserve System*
Schedule Training
 
*Must install Coral and be a trained user to reserve a slot on this system.

  

Documentation

Manual

Facilities