Hotplate Bonder
General Information
Equipment Name: Hotplate Bonder
Coral Name: not listed
FIC: Tim Sands
Process/Equipment Owner: Jeremy Schroeder
Location: BRK 1217
System Information
General Description:
- Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes
System Capabilities:
- Sample size
- 4” diameter wafer maximum
- 2 independently controlled hot plates
- Temperature
- 400°C maximum
- Force sensor
- 999lbs maximum
- Enclosure for inert gas ambient
- Water cooling for quick cycling of samples
- 2” adapter available for improving pressure uniformity
Useful System Links
Equipment Use FeesSchedule Training
*Must install Coral and be a trained user to reserve a slot on this system.