Birck Nanotechnology Center

Hotplate Bonder

General Information

Equipment Name: Hotplate BonderAxitron

Coral Name: not listed

FIC: Tim Sands

Process/Equipment Owner: Jeremy Schroeder

Location: BRK 1217

System Information

General Description:

  • Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes

System Capabilities:

  • Sample size
    • 4” diameter wafer maximum
  • 2 independently controlled hot plates
  • Temperature
    • 400°C maximum
  • Force sensor
    • 999lbs maximum
  • Enclosure for inert gas ambient
  • Water cooling for quick cycling of samples
  • 2” adapter available for improving pressure uniformity

Useful System Links

Equipment Use Fees
Schedule Training
 

*Must install Coral and be a trained user to reserve a slot on this system.  

Facilities