Disco DAD-2H/6 Dicing Saw
General Information
Equipment Name: Disco DAD-2H/6 Dicing Saw
Coral Name: DiscoDad
Process/Equipment Owner: Tim Miller
Location: brk2261
Max Wafer Size: 6
Superusers:
System Information
General Description:
The Disco dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices.
System Capabilities:
Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up to 6 inches in diameter, and up to 1 millimeter thick.
A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.
General Comments:
The programming required to operate the dicing saw is moderately difficult. Unless the user is going to need the machine on a very frequent basis, they should consider having Tim or one of the other staff members familiar with the saw perform their cutting.
Useful System Links
Equipment Use FeesReserve System*
Schedule Training
*Must install Coral and be a trained user to reserve a slot on this system.