Disco DAD-2H/6 Dicing Saw

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Disco DAD-2H/6 Dicing Saw

General Information

iLab Name: DiscoDad

iLab Core: BRK Packaging and Assembly Core

FIC: Shared

Owner: Tim Miller

Location: brk2261

Max Wafer Size: 6

System Information

General Description

The Disco dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices.

Capabilities

Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up to 6 inches in diameter, and up to 1 millimeter thick.

A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.

Materials Compatibility

Not Applicable