Wire Bonder

Return to Equipment at Birck Nanotechnology Center

Wire Bonder Wire Bonder

General Information

iLab Name: K and S 4526

iLab Core: BRK Packaging and Assembly Core

FIC: David Janes

Owner: Tim Miller

Location: brk2092

System Information

General Description

These systems use gold wire to bond. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Capabilities

The West Bond bonder has 25 micron gold wire and is operated manually. The K&S bonder has a wire size of 125 microns by 25 microns and may be operated manually or by programming. The pads must be larger than the size of a wire bond foot. Wire bond feet are typically 50 microns in width and 75 microns long. The recommended pads are 100 x100 microns minimum size on both chip and package for the West Bond. 100 x 150 microns for the K&S Ribbon Bonder.

Materials Compatibility

Not Applicable