BNC Equipment Updates http://www.purdue.edu/dp/Nanotechnology/facilities/equipment-list.php Updates to the Birck Nanotechnology Center's equipment page will be posted here. Feeder 1.5.6(475) http://reinventedsoftware.com/feeder/ http://blogs.law.harvard.edu/tech/rss en Fri, 15 Aug 2008 12:09:49 -0400 Fri, 15 Aug 2008 12:09:49 -0400 Updates 08.15.08 SEM

FEI Nova 200 NanoLab DualBeamTM-SEM/FIB

Hitachi S-4800 Field Emission SEM

TEM

Titan 80-300 kV Environmental Electron Microscope

]]> Fri, 15 Aug 2008 12:09:45 -0400 updates-081508 Updated BNC Equipment List - 5/2008 Please visit the equipment listing online for more detailed information.

AFM

* Veeco Dimension AFM

Anodization

* Anodization

Atomic Layer Deposition

* Atomic Layer Deposition

Biology

Conventional Thermal Processing

* Ammonia Anneal
* Blue M Oven
* Horizontal Furnace
* Nitric Oxide Anneal
* Pyrogenic Oxidation

Dry Etching

* Branson Asher
* Panasonic E620 Etcher
* Plasma Tech RIE
* STS ASE DRIE
* STS AOE DRIE
* Xenon Difluoride Etch

E-beam Evaporation

* Airco E-beam Evaporator
* CHA E-beam Evaporator
* Leybold E-beam Evaporator
* Varian E-beam Evaporator

E-beam Lithography

* Vistec VB6

Electrodeposition

* Electrodeposition (BASi)
* Electrodeposition (Princeton Applied)

FIB

Field Emission Vacuum

FTIR

Hall Effect

* Hall Effect MMR

Imaging Interferometer

Metalorganic CVD

* Epigress
* OMVPE - Aixtron

Molecular Beam Epitaxy

* Molecular Beam Epitaxy Growth System

Optical Photolithography

* Canon PLA-501F Wafer Aligner
* Suss MJB-3 Wafer Aligner
* Suss MA 6 Mask Aligner

Photomask Generation

* Electromask System


Plasma Enhanced CVD

* Axic PECVD
* Carbon Nanotube PECVD

Polishing & Planarization

Probe Stations

* Probe Station I
* Probe Station II
* Probe Station III

Rapid Thermal Processing

* Heatpulse 610
* Minipulse RTA

Sputtering Systems

* Anatech Sputterer
* Nitride sputter system
* Perkin Elmer 2400 Sputterer

STM

Surface Analysis

* Filmetrics
* Olympus BX-60
* Stokes Ellipsometer

Surface Profilometry

* Alpha-Step IQ

TEM

Thermal Evaporation

* Vecco Thermal Evaporator

Vapor Phase Epitaxy

* HVPE

Wafer Bonding

* Suss SB6e Substrate Bonder

Wafer Cutting & Dicing

* Disco DAD-2H/6 Dicing Saw

Wet Chemical Processing

* Chemical Fume Hoods

Wire Bonding

* Wire bonder

XPS

XRD

* XRD

Other/Not Listed

* Contact Annealer
* Critical point dryer (CPD)
* Desk-Top Precision Spin Coating System
* DynaPro99 Dynamic Light Scattering
* Hotplate Bonder
* Laser lift-off and laser annealing
* Oxide PLD system
* Parylene CVD
* PL Cryostat
* Ultrapure Water System
* UV flood curing system

]]> Thu, 15 May 2008 11:18:53 -0400 updated-bnc-equipment-list-52008 Updated BNC Equipment List http://www.purdue.edu/dp/Nanotechnology/facilities/equipment-list.php Equipment information on the BNC Website:

AFM

* Veeco Dimension AFM

Atomic Layer Deposition

* Atomic Layer Deposition

Biology

Conventional Thermal Processing

* Ammonia Anneal
* Blue M Oven
* Horizontal Furnace
* Nitric Oxide Anneal
* Pyrogenic Oxidation

Dry Etching

* Branson Asher
* Plasma Tech RIE
* STS ASE DRIE
* STS AOE DRIE
* Xenon Difluoride Etch

E-beam Evaporation

* Airco E-beam Evaporator
* CHA E-beam Evaporator
* Leybold E-beam Evaporator
* Varian E-beam Evaporator

E-beam Lithography

* Vistec VB6

Electrodeposition

FIB

Field Emission Vacuum

FTIR

Hall Effect

Imaging Interferometer

Metalorganic CVD

* Aixtron
* Epigress

Molecular Beam Epitaxy

* Molecular Beam Epitaxy Growth System

Optical Photolithography

* Canon PLA-501F Wafer Aligner
* Suss MJB-3 Wafer Aligner
* Suss MA 6 Mask Aligner

Photomask Generation

* Electromask System


Plasma Enhanced CVD

* Axic PECVD
* Carbon Nanotube PECVD

Polishing & Planarization

Probe Stations

* Probe Station I
* Probe Station II
* Probe Station III

Rapid Thermal Processing

* Heatpulse 610
* Minipulse RTA

Sputtering Systems

* Anatech Sputterer
* Perkin Elmer 2400 Sputterer

STM

Surface Analysis

* Filmetrics

Surface Profilometry

* Alpha-Step IQ

TEM

Thermal Evaporation

* Vecco Thermal Evaporator

Vapor Phase Epitaxy

Wafer Bonding

* Suss SB6e Substrate Bonder

Wafer Cutting & Dicing

* Disco DAD-2H/6 Dicing Saw

Wet Chemical Processing

* Chemical Fume Hoods

Wire Bonding

* Wire bonder

XPS

XRD

* XRD

Other/Not Listed

* Contact Annealer
* Critical point dryer (CPD)
* Desk-Top Precision Spin Coating System
* Parylene CVD
* Ultrapure Water System

]]> Fri, 15 Feb 2008 14:13:03 -0500 updated-bnc-equipment-list Updates - 11.08.2007 http://www.purdue.edu/dp/Nanotechnology/facilities/equipment-list.php New information is available for the following equipment:

Ammonia Anneal
Blue M Oven
Horizontal Furnace
Nitric Oxide Anneal
Pyrogenic Oxidation
Heatpulse 610
Minipulse RTA

]]> Thu, 08 Nov 2007 09:52:57 -0500 updates-11082007 Updates - 10.17.2007 http://www.purdue.edu/dp/Nanotechnology/facilities/equipment-list.php New information is available for the following equipment:

STS ASE DRIE
Airco E-beam Evaporator
CHA E-beam Evaporator
Leybold E-beam Evaporator
Varian E-beam Evaporator
Canon PLA-501F Wafer Aligner
Suss MJB-3 Wafer Aligner
Anatech Sputterer
Perkin Elmer 2400 Sputterer
Vecco Thermal Evaporator
Critical point dryer (CPD)
Desk-Top Precision Spin Coating System
Contact Annealer

]]> Wed, 17 Oct 2007 16:34:25 -0400 updates-10172007